DocumentCode
3367848
Title
Equipment and APC integration at AMD with workstream
Author
Lantz, Mikkcl
Author_Institution
AMD, Sunnyvale, CA, USA
fYear
1999
fDate
1999
Firstpage
325
Lastpage
327
Abstract
This paper discusses the reason for starting the equipment integration project at AMD´s Submicron Development Center, SDC, and how it led to the development of the APC framework. The architecture of the workstream, EIs and APC and how they function together are covered
Keywords
fault location; integrated circuit manufacture; process control; production control; production engineering computing; AMD Submicron Development Center; APC framework; APC integration; automatic process control; equipment integration; fault detection; run to run control; workstream architecture; Artificial intelligence; Communication system control; Control system synthesis; Displays; Fault diagnosis; Furnaces; Graphics; Logic; Metrology; Milling machines;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1523-553X
Print_ISBN
0-7803-5403-6
Type
conf
DOI
10.1109/ISSM.1999.808801
Filename
808801
Link To Document