• DocumentCode
    3371213
  • Title

    Passivation study for In0.4AlAs/In0.65GaAs HEMTs by UHV RPECVD grown SiNx dielectrics and their impact on I-V kink and low-frequency dispersion phenomena

  • Author

    Kim, Dae-Hyun ; Noh, Hun-Hee ; Choi, Sung-Sun ; Lee, Jae.-Hak. ; Seo, Kwang-Seok

  • Author_Institution
    ISRC, Seoul Nat. Univ., South Korea
  • fYear
    2004
  • fDate
    31 May-4 June 2004
  • Firstpage
    354
  • Lastpage
    357
  • Abstract
    The influence of silicon nitride (SiNx) passivation on the DC and low-frequency transconductance dispersion behaviours of In0.4AIAs/In0.65GaAs HEMTs has been investigated. Although the surface passivation using MBE grown thin InP etch-stop is effective to suppress I-V kink phenomena, it has critical drawbacks of large gate leakage current, low gate turn-on (Von) and breakdown voltage (BVgd) due to low Schottky barrier height (SBH) of InP layer. To resolve this problem, we have developed innovative SiNx passivation process to prevent I-V kink as well as to maintain low gate leakage current by UHV remote-PECVD system. Through the optimized SiNx passivation process, the DC I-V kink and the low-frequency transconductance dispersion could be significantly improved.
  • Keywords
    III-V semiconductors; Schottky barriers; aluminium compounds; dielectric materials; electric admittance; electric breakdown; gallium arsenide; high electron mobility transistors; indium compounds; leakage currents; passivation; plasma CVD; silicon compounds; HEMT; I-V kink; In0.4AlAs-In0.65GaAs; MBE; Schottky barrier height; SiNx; UHV RPECVD; breakdown voltage; gate leakage current; low-frequency transconductance dispersion; silicon nitride passivation; Etching; Gallium arsenide; HEMTs; Indium phosphide; Leakage current; MODFETs; Passivation; Schottky barriers; Silicon compounds; Transconductance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 2004. 16th IPRM. 2004 International Conference on
  • ISSN
    1092-8669
  • Print_ISBN
    0-7803-8595-0
  • Type

    conf

  • DOI
    10.1109/ICIPRM.2004.1442728
  • Filename
    1442728