• DocumentCode
    3372325
  • Title

    The Influence of surface Profile on Leakage in Roomtemperature Seal-Bonding

  • Author

    Okada, H. ; Itoh, T. ; Suga, T.

  • Author_Institution
    Univ. of Tokyo, Tokyo
  • fYear
    2007
  • fDate
    10-14 June 2007
  • Firstpage
    339
  • Lastpage
    342
  • Abstract
    We have developed a new calculation method of sealing quality at a bonding interface based on measured data of surface profiles and investigated influence of the surface profiles on leakage in room temperature vacuum seal-bonding. Leak rates decreased slowly as contact ratio increased, before they decreased drastically at a contact ratio close to Pc at which leak paths disappear at a bonding interface. When a contact ratio is lower than the one at which the leak rates decreased markedly, the leak rate is at least 10-13 Pa m3/sec which is insufficient to keep inside cavity pressure vacuum for a long time. These results show that vacuum sealing needs the contact ratio which is higher than Pc.
  • Keywords
    bonding processes; seals (stoppers); surface treatment; cavity pressure vacuum; contact ratio; leak rates; room temperature seal-bonding; surface profile; vacuum seal-bonding; vacuum sealing; Atomic measurements; Chemicals; Gaskets; Gold; Lattices; Micromechanical devices; Rough surfaces; Surface roughness; Temperature; Wafer bonding; Leakage; MEMS; Surface Activated bonding (SAB); Vacuum sealing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
  • Conference_Location
    Lyon
  • Print_ISBN
    1-4244-0842-3
  • Electronic_ISBN
    1-4244-0842-3
  • Type

    conf

  • DOI
    10.1109/SENSOR.2007.4300137
  • Filename
    4300137