A Wafer Transfer Technology for Integration of RF MEMS and CMOS on Organic Substrate

Author

Zhang, Qing Xin ; Yu, A.B. ; Tang, M. ; Li, H.Y. ; Yang, R. ; Liao, E.B. ; Guo, L.H. ; Kumar, R. ; Liu, A.Q. ; Lo, G.Q. ; Balasubramanian, N. ; Kwong, D.L.

Author_Institution

Inst. of Microelectron., Singapore

fYear

2007

fDate

10-14 June 2007

Firstpage

419

Lastpage

422

Abstract

A thermal bonding based wafer transfer technology was developed and successfully applied to integrate RF MEMS switch and CMOS ICs on an organic substrate. The major process modules and challenges in this transfer technology are discussed. By integrated together on the new substrate, the RF-MEMS switch illustrates significantly improved performance, and the CMOS show preserved functionality. This technology demonstrates the feasibility and potential applicability of building high performance, compact RF system for wireless communication.

Keywords

CMOS integrated circuits; micromechanical devices; radiofrequency integrated circuits; wafer bonding; CMOS IC; RF MEMS integration; organic substrate; thermal bonding; wafer transfer technology; wireless communication; Bonding processes; CMOS integrated circuits; CMOS technology; Etching; Radio frequency; Radiofrequency microelectromechanical systems; Silicon; Substrates; Switches; Wafer bonding; CMOS; RF MEMS; integration; organic substrate; wafer transfer technology (WTT);

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International

Conference_Location

Lyon

Print_ISBN

1-4244-0842-3

Electronic_ISBN

1-4244-0842-3

Type

conf

DOI

10.1109/SENSOR.2007.4300157

Filename

4300157