• DocumentCode
    3372751
  • Title

    Logical effort models with voltage and temperature extensions in super-/near-/sub-threshold regions

  • Author

    Chang, Ming-Hung ; Hsieh, Chung-Ying ; Chen, Mei-Wei ; Hwang, Wei

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
  • fYear
    2011
  • fDate
    25-28 April 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The voltage-/temperature-induced delay estimation error of conventional logical effort is much more severe in near/sub-threshold region. In this paper, super-/near-/sub-threshold logical effort models are proposed to eliminate delay estimation error caused by voltage and temperature variations. These models establish over the four different nanoscale CMOS generations. They also take environmental parameter variations with wide supply voltage 0.1~1V and full temperature -50~125°C range into account. The simulation results are using UMC 90-nm, PTM 65-, 45- and 32-nm bulk CMOS technologies, respectively. The average absolute error among the three regions are only 6.01%, 4.12%, 8.01% and 6.55% for UMC 90-nm, PTM 65-, 45- and 32-nm technology, respectively. Proposed models extend the original high performance circuits design in super-threshold region to low power circuit design in near-threshold and sub-threshold regions. They are useful for future green electronics applications.
  • Keywords
    CMOS integrated circuits; NAND circuits; NOR circuits; integrated circuit design; nanoelectronics; power integrated circuits; delay estimation error; logical effort models; low power circuit design; nanoscale CMOS generations; temperature extensions; threshold regions; voltage extensions; Biological system modeling; Delay; Integrated circuit modeling; Logic gates; Mathematical model; Semiconductor device modeling; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, Automation and Test (VLSI-DAT), 2011 International Symposium on
  • Conference_Location
    Hsinchu
  • ISSN
    Pending
  • Print_ISBN
    978-1-4244-8500-0
  • Type

    conf

  • DOI
    10.1109/VDAT.2011.5783613
  • Filename
    5783613