• DocumentCode
    3372782
  • Title

    Comparison of three methods to measure the internal pressure of empty MEMS packages

  • Author

    Wang, B. ; Tanaka, S. ; De Coster, J. ; Severi, Simone ; Witvrouw, A. ; Wevers, M. ; De Wolf, I.

  • Author_Institution
    imec, Leuven, Belgium
  • fYear
    2012
  • fDate
    2-6 July 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Three different measurement methods for the measurement of the pressure inside empty MEMS packages are demonstrated and discussed. They are based on measurements of capacitance, cap resonance or cap buckling. The capacitance measurement method is shown to be the most sensitive of the three methods for this application, with a pressure resolution of 11mbar.
  • Keywords
    capacitance measurement; micromechanical devices; cap buckling; cap resonance; capacitance measurement method; empty MEMS package; internal pressure; Capacitance; Capacitance measurement; Frequency measurement; Micromechanical devices; Packaging; Pressure measurement; Resonant frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
  • Conference_Location
    Singapore
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4673-0980-6
  • Type

    conf

  • DOI
    10.1109/IPFA.2012.6306268
  • Filename
    6306268
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3372782