DocumentCode
3376097
Title
Computation of switching noise in PCBs for digital packages
Author
Yook, Jong-Gwan ; Chandramouli, V. ; Katehi, Linda P. ; Sakallah, Karem A.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
fYear
1995
fDate
2-4 Oct 1995
Firstpage
37
Lastpage
39
Abstract
Simultaneous switching noise in printed circuit boards for digital packages is computed using a hybrid technique which combines electromagnetic analysis (3D FEM) and circuit simulation (HSPICE) for fast and efficient time and frequency domain analysis
Keywords
SPICE; circuit analysis computing; circuit noise; finite element analysis; frequency-domain analysis; packaging; printed circuit design; time-domain analysis; 3D FEM; HSPICE; PCBs; circuit simulation; digital packages; electromagnetic analysis; frequency domain analysis; printed circuit boards; switching noise; time domain analysis; Circuit analysis computing; Circuit noise; Circuit simulation; Computational modeling; Distributed computing; Equivalent circuits; Laboratories; Packaging; Printed circuits; Transmission line theory;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1995
Conference_Location
Portland, OR
Print_ISBN
0-7803-3034-X
Type
conf
DOI
10.1109/EPEP.1995.524688
Filename
524688
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