• DocumentCode
    3376633
  • Title

    Using Distributed Circuits to Model Power Capacitor Behavior

  • Author

    Brown, Robert W.

  • Author_Institution
    RMIT Univ., Melbourne, VIC
  • fYear
    2005
  • fDate
    21-24 Nov. 2005
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Distributed circuit modeling of stacked and spiral capacitors is described. The modeling, executed on a spreadsheet, allows what-if analysis of the effects of changes in capacitor specifications such as metal film resistivity and changes in geometric dimensions on dissipation factor, equivalent lumped capacitance, film current density, film voltage and power distribution profile. The system provides a complete range of data including equivalent series resistance and complex impedance. The effects of varying degrees of edge disconnection are provided in the model system. It provides a tool not only for power circuit designers, but for manufacturers concerned with design optimization and understanding of the effects of varying degrees of in-use degradation. In this study, a simple capacitor model with varying degrees of edge disconnection is explored. The results correspond to common experience whereby degraded capacitors exhibit large increases in dissipation factor with little change in nominal capacitance. The results predict the existence of hot spots in a capacitor degraded by partial edge disconnection.
  • Keywords
    equivalent circuits; power capacitors; complex impedance; dissipation factor; distributed circuits; equivalent series resistance; partial edge disconnection; power capacitor behavior; spiral capacitors; Capacitance; Circuits; Conductivity; Current density; Degradation; Power capacitors; Power system modeling; Solid modeling; Spirals; Voltage; capacitor; distributed; endurance; model;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2005 2005 IEEE Region 10
  • Conference_Location
    Melbourne, Qld.
  • Print_ISBN
    0-7803-9311-2
  • Electronic_ISBN
    0-7803-9312-0
  • Type

    conf

  • DOI
    10.1109/TENCON.2005.300926
  • Filename
    4084909