• DocumentCode
    3377061
  • Title

    Properties of encapsulated CIGS cells in 85°C/85%RH

  • Author

    Olsen, Larry C. ; Gross, Mark E. ; Kundu, Sambhu N. ; Shafarman, William N.

  • Author_Institution
    Pacific Northwest National Laboratory, Richland, WA 99354, USA
  • fYear
    2008
  • fDate
    11-16 May 2008
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    This paper concerns studies of encapsulated cells subjected to an environment of 85°C and 85%RH (85/85). Cells are encapsulated with PNNL multi-layer coatings (referred to as PML coatings) utilizing alternating layers of Al2O3, and an advanced polymer. The new polymer has been determined to withstand the 85/85 environment. Two types of cells were used for these studies, namely, SSI mini-modules (which are actually CIGSS devices) and CIGS cells provided by the Institute of Energy Conversion (IEC). Cells were coated and stressed at 85/85 in an environmental chamber. Current-voltage characteristics were acquired before and after coating, and periodically after being subjected to the 85/85 environment. Whereas coated SSI modules were determined to last 1000 hours when stressed at 60°C/90%RH without degradation, the efficiency of these modules degrade to a level of 60% of the beginning-of-life value when stressed at 85/85. Encapsulated IEC cells, however, have exhibited extraordinary results. The efficiency of several encapsulated cells did not decrease for 1500 hours in an 85°C/85%RH environment. This results establishes a benchmark for stressed, encapsulated CIGS cells.
  • Keywords
    Building integrated photovoltaics; Coatings; Current-voltage characteristics; Degradation; Energy conversion; Humidity; IEC standards; Moisture; Polymer films; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2008. PVSC '08. 33rd IEEE
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-1640-0
  • Electronic_ISBN
    0160-8371
  • Type

    conf

  • DOI
    10.1109/PVSC.2008.4922498
  • Filename
    4922498