DocumentCode
3377220
Title
Multi-band RF SAW filter for mobile phone using surface mount plastic package
Author
Yoshimoto, Susumu ; Yamamoto, Yasushi ; Takahashi, Yoshihiro ; Otsuka, Eiichi
Author_Institution
Res. & Dev. Dept., NRS Technol. Inc, Kawasaki, Japan
Volume
1
fYear
2002
fDate
8-11 Oct. 2002
Firstpage
113
Abstract
In recent years, multi-band RF SAW filters for mobile phone are strongly required. In this work, as the example of multi-band SAW filters, we report PDC triple-band SAW filter and EGSM /DCS dual-band balanced SAW filter using surface mount plastic package. These filters are encapsulated in plastic package and they are made by our new plastic molding technology. The plastic package has advantages of lightweight low material cost and low assembly cost. To integrate plural filters to one chip, we refined the conventional lift-off method. The method can realize easy fabrication of SAW chip for multi-band filter We utilized 36Y-X LiTaO3 for substrates for the filter. The electrode structure of each filter is longitudinal-mode resonator filter With regards to PDC triple-band filter, we achieved typical insertion loss of 2.0 dB / 2.1 dB / 2.2 dB with bandwidth of 33 MHz / 15 MHz / 24 MHz for 800 MHz (called CD-band) / 800 MHz (called A-band) / 1.5 GHz, respectively, with excellent high rejection levels. And for another application of the plastic package, we developed EGSM/DCS Rx dual-band balanced SAW filter. We achieved insertion loss of 2.2 dB / 3.0 dB for EGSM and DCS filter, respectively, with good amplitude and phase balance. We could realize multi-band SAW filters using the plastic package and could confirm its usability for SAW devices.
Keywords
mobile handsets; plastic packaging; surface acoustic wave filters; 1.5 GHz; 15 MHz; 2.0 dB; 2.1 dB; 2.2 dB; 24 MHz; 3.0 dB; 33 MHz; 800 MHz; EGSM/DCS dual-band balanced SAW filter; PDC triple-band SAW filter; lift-off method; longitudinal-mode resonator filter; mobile phone; multi-band RF SAW filter; multi-band filter; plural filters; surface mount plastic package; Assembly; Costs; Distributed control; Dual band; Insertion loss; Mobile handsets; Plastic packaging; Radio frequency; Resonator filters; SAW filters;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2002. Proceedings. 2002 IEEE
ISSN
1051-0117
Print_ISBN
0-7803-7582-3
Type
conf
DOI
10.1109/ULTSYM.2002.1193365
Filename
1193365
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