Polymer Microchip for Electrophoresis-Mass Spectrometry Fabricated by Hot Embossing and Low Temperature Direct Bonding

Author

Suzuki, T. ; Kitagawa, F. ; Shinohara, H. ; Mizuno, J. ; Otsuka, K. ; Shoji, S.

Author_Institution

Waseda Univ., Tokyo

fYear

2007

fDate

10-14 June 2007

Firstpage

1617

Lastpage

1620

Abstract

Integrated electrophoresis-mass spectrometry polymer devices were fabricated. The electrospray ionization (ESI) emitter tip structure was formed directly at the microchip electrophoresis (MCE) outlet. Since these devices enable negligible dead volume at the electrospray port, efficient spray of the sample necessary for high resolution mass spectrometry (MS) was realized. Stable spray was also achieved at the low flow rate (-0.1 muL/min) without additional pump. Low cost and high performance COP MCE-MS chip was fabricated by hot embossing and low temperature direct bonding.

Keywords

bonding processes; electrophoresis; embossing; mass spectroscopy; polymers; sensors; electrophoresis-mass spectrometry; electrospray ionization emitter; hot embossing; low temperature direct bonding; microchip electrophoresis; polymer microchip; Bonding; Electrodes; Embossing; Gold; Ionization; Nanoscale devices; Plasma temperature; Polymers; Spectroscopy; Spraying; COP; Electrospray Ionization; Hot Embossing; Low Temperature Direct Bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International

Conference_Location

Lyon

Print_ISBN

1-4244-0842-3

Electronic_ISBN

1-4244-0842-3

Type

conf

DOI

10.1109/SENSOR.2007.4300458

Filename

4300458