A Novel Low-Temperature Microcap Packaging using SU-8 Bonding

In this paper, we report a new technology for lightweight, low temperature bonding process with thin film polymer microcap. Polymer (SU-8) was used both for the intermediate adhesive layer and as a cap structure. Silicon oxide thin film was deposited using furnace to separate the microcap from the carrier wafer. The measured tensile strength of the package is in the range of 7-17 MPa. This thin-film polymer microcap on the host wafer was successfully demonstrated through low-temperature bonding and bulk micromachining. The experimental result shows that relatively high bonding strength at low bonding temperature can be achieved.