Comprehensive electro-thermal(ET) analysis with considering ET coupling

Temperature and supply voltage directly influence IC performance and reliability. Thus electro-thermal (ET) analysis including power/ground (P/G) analysis and thermal analysis is very important in IC design. But present ET analysis is simply implemented because P/G analysis doesn´t consider temperature changes and thermal analysis always assume supply voltage as a constant. On the observation that temperature´s influence on leakage current (ET coupling effect) and supply voltage´s influence on power consumption, this work propose a novel SOR-based comprehensive ET method that iteratively solves the temperature with thermal analysis and the supply voltage with P/G analysis. In the method, the P/G analysis and thermal analysis are considered as two interactional processes rather than two independent counterparts. Experimental results show that compared with our method, present ET analysis methods will give too pessimistic or optimistic results W/O considering ET coupling effect.