DocumentCode
3381604
Title
The manufacturing of Si base thin film solar cell modules
Author
Li, Tingkai
Author_Institution
Hunan Gongchuang Photovoltaic Sci. & Technol. Co., Ltd., Hengyang, China
fYear
2011
fDate
25-28 Oct. 2011
Firstpage
425
Lastpage
429
Abstract
Si based thin film solar cell will be next generation of solar cell products. In order to fabricate high efficiency Si base thin film solar cell, High density (HD) and very high frequency (VHF)-PECVD technologies have been developed for high quality, large scaling ue-Si, μc-SiGe, and μc-SiC film deposition. The high-density and very high frequency plasma technique offers the significant advantages of high plasma density, low plasma potential, and independent control of ion flux and ion bombardment energy which are critical for controlling the bulk and interfacial characteristics of the deposited films. In comparison to other CVD processes, the HD and VHF-PECVD technique offers potential advantages of the deposition of higher growth rates, higher quality films at lower processing temperatures, void free gap filling of high aspect ratio features, self-planarization, lower impurity levels and large scaling capability. The experimental results show typical deposition rate of the μ-Si thin films by HD-PECVD was greater than 10 A/s, the typical microcrystalline volume fraction and the average crystallite size corresponding to 〈111〉 orientation were 75% and 160 Å, respectively. Amorphous SiGe and SiC films have been achieved, μc-SiGe, μc-SiC films are under processing. The stabilized efficiency of tandem junction solar cells with a-Si/μc-Si films can reach 12%.
Keywords
Ge-Si alloys; elemental semiconductors; plasma CVD coatings; semiconductor growth; semiconductor thin films; solar cells; μc-SiC film deposition; μc-SiGe; HD technique; Si; Si base thin film solar cell module; SiC; SiGe; VHF-PECVD technology; amorphous SiGe; crystallite size; deposition rate; high density plasma technique; impurity level; interfacial characteristic; ion bombardment energy; ion flux; microcrystalline volume fraction; plasma density; plasma potential; self-planarization; solar cell product; ue-Si; very high frequency plasma technique; void free gap filling; Films; Glass; Inductors; Radio frequency; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC (ASICON), 2011 IEEE 9th International Conference on
Conference_Location
Xiamen
ISSN
2162-7541
Print_ISBN
978-1-61284-192-2
Electronic_ISBN
2162-7541
Type
conf
DOI
10.1109/ASICON.2011.6157212
Filename
6157212
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