• DocumentCode
    3381604
  • Title

    The manufacturing of Si base thin film solar cell modules

  • Author

    Li, Tingkai

  • Author_Institution
    Hunan Gongchuang Photovoltaic Sci. & Technol. Co., Ltd., Hengyang, China
  • fYear
    2011
  • fDate
    25-28 Oct. 2011
  • Firstpage
    425
  • Lastpage
    429
  • Abstract
    Si based thin film solar cell will be next generation of solar cell products. In order to fabricate high efficiency Si base thin film solar cell, High density (HD) and very high frequency (VHF)-PECVD technologies have been developed for high quality, large scaling ue-Si, μc-SiGe, and μc-SiC film deposition. The high-density and very high frequency plasma technique offers the significant advantages of high plasma density, low plasma potential, and independent control of ion flux and ion bombardment energy which are critical for controlling the bulk and interfacial characteristics of the deposited films. In comparison to other CVD processes, the HD and VHF-PECVD technique offers potential advantages of the deposition of higher growth rates, higher quality films at lower processing temperatures, void free gap filling of high aspect ratio features, self-planarization, lower impurity levels and large scaling capability. The experimental results show typical deposition rate of the μ-Si thin films by HD-PECVD was greater than 10 A/s, the typical microcrystalline volume fraction and the average crystallite size corresponding to 〈111〉 orientation were 75% and 160 Å, respectively. Amorphous SiGe and SiC films have been achieved, μc-SiGe, μc-SiC films are under processing. The stabilized efficiency of tandem junction solar cells with a-Si/μc-Si films can reach 12%.
  • Keywords
    Ge-Si alloys; elemental semiconductors; plasma CVD coatings; semiconductor growth; semiconductor thin films; solar cells; μc-SiC film deposition; μc-SiGe; HD technique; Si; Si base thin film solar cell module; SiC; SiGe; VHF-PECVD technology; amorphous SiGe; crystallite size; deposition rate; high density plasma technique; impurity level; interfacial characteristic; ion bombardment energy; ion flux; microcrystalline volume fraction; plasma density; plasma potential; self-planarization; solar cell product; ue-Si; very high frequency plasma technique; void free gap filling; Films; Glass; Inductors; Radio frequency; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC (ASICON), 2011 IEEE 9th International Conference on
  • Conference_Location
    Xiamen
  • ISSN
    2162-7541
  • Print_ISBN
    978-1-61284-192-2
  • Electronic_ISBN
    2162-7541
  • Type

    conf

  • DOI
    10.1109/ASICON.2011.6157212
  • Filename
    6157212