DocumentCode
3382946
Title
Interconnect system compression analysis for multi-core architectures
Author
Liu, Jiangjiang ; Zhang, Jianyong ; Mahapatra, Nihar
Author_Institution
Dept. of Comp. Sci., Lamar Univ., Beaumont, TX, USA
fYear
2010
fDate
27-29 Sept. 2010
Firstpage
317
Lastpage
320
Abstract
One of the major problems associated with integrating multiple cores on a single chip is the performance demand it places on the interconnect system because of the combined traffic generated by multiple simultaneously executing threads. In this paper, we analyze interconnect compression potential in the two primary types of information - instructions and data - and important interconnect components in multi-core systems. In our study, lower compression ratio means better compression. We show great compression potential with 0.47-0.67 zero-information compression ratio, 0.28-0.29 zeroth-order compression ratio, and 0.11-0.14 first-order compression ratio obtained with different levels of compression specialization.
Keywords
computer architecture; multiprocessing systems; multiprocessor interconnection networks; interconnect system compression analysis; multicore architecture; processor-memory traffic; Analytical models; Benchmark testing; Computational modeling; Entropy; Integrated circuit interconnections; Markov processes; Multicore processing;
fLanguage
English
Publisher
ieee
Conference_Titel
SOC Conference (SOCC), 2010 IEEE International
Conference_Location
Las Vegas, NV
ISSN
Pending
Print_ISBN
978-1-4244-6682-5
Type
conf
DOI
10.1109/SOCC.2010.5784654
Filename
5784654
Link To Document