DocumentCode
3383750
Title
High speed interconnect optimization
Author
Vasa, Mallikarjun ; Reddy, Arun Chada ; Mutnury, Bhyrav ; Kumar, Sanjay ; Vasanth, R.D.
Author_Institution
Dell Enterprise Server Group, Bangalore, India
fYear
2015
fDate
26-29 May 2015
Firstpage
8
Lastpage
11
Abstract
As the signal speeds begin to increase, small routing imperfections start to dictate the overall channel performance. Commonly found routing imperfections such as trace breakout, via discontinuity and AC coupling capacitor pad capacitance need to be further optimized to meet the desired channel specification based on bit error rate (BER). Upfront modeling and analysis of such imperfections at high frequencies can mitigate expensive board redesigns to achieve the desired performance. This paper demonstrates the impact of each such routing imperfection(s) for data rates up to 40 Gbps. Model to hardware correlation is performed to ensure model accuracy. The impact physical routing parameters on return and insertion loss in frequency and time domain are studied to help designers optimize their channel.
Keywords
error statistics; network routing; optimisation; printed circuit interconnections; time-frequency analysis; AC coupling capacitor pad capacitance; BER; bit error rate; channel specification; frequency domain; hardware correlation; high speed interconnect optimization; model accuracy; overall channel performance; physical routing parameters; small routing imperfections; time domain; trace breakout; Capacitors; Couplings; Impedance; Insertion loss; Routing; Time-frequency analysis; Anti-Pads; Interconnect; PCB; Voids;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific Symposium on
Conference_Location
Taipei
Print_ISBN
978-1-4799-6668-4
Type
conf
DOI
10.1109/APEMC.2015.7175345
Filename
7175345
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