• DocumentCode
    3383750
  • Title

    High speed interconnect optimization

  • Author

    Vasa, Mallikarjun ; Reddy, Arun Chada ; Mutnury, Bhyrav ; Kumar, Sanjay ; Vasanth, R.D.

  • Author_Institution
    Dell Enterprise Server Group, Bangalore, India
  • fYear
    2015
  • fDate
    26-29 May 2015
  • Firstpage
    8
  • Lastpage
    11
  • Abstract
    As the signal speeds begin to increase, small routing imperfections start to dictate the overall channel performance. Commonly found routing imperfections such as trace breakout, via discontinuity and AC coupling capacitor pad capacitance need to be further optimized to meet the desired channel specification based on bit error rate (BER). Upfront modeling and analysis of such imperfections at high frequencies can mitigate expensive board redesigns to achieve the desired performance. This paper demonstrates the impact of each such routing imperfection(s) for data rates up to 40 Gbps. Model to hardware correlation is performed to ensure model accuracy. The impact physical routing parameters on return and insertion loss in frequency and time domain are studied to help designers optimize their channel.
  • Keywords
    error statistics; network routing; optimisation; printed circuit interconnections; time-frequency analysis; AC coupling capacitor pad capacitance; BER; bit error rate; channel specification; frequency domain; hardware correlation; high speed interconnect optimization; model accuracy; overall channel performance; physical routing parameters; small routing imperfections; time domain; trace breakout; Capacitors; Couplings; Impedance; Insertion loss; Routing; Time-frequency analysis; Anti-Pads; Interconnect; PCB; Voids;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4799-6668-4
  • Type

    conf

  • DOI
    10.1109/APEMC.2015.7175345
  • Filename
    7175345