2002 IEEE International Integrated Reliability Workshop. Final Report (Cat. No.02TH8634)

fYear

2002

fDate

21-24 Oct. 2002

Keywords

reliability; Cu interconnects; NBTI phenomena; high-k dielectrics; hot carrier degradation; product reliability; reliability; thin oxides;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Reliability Workshop Final Report, 2002. IEEE International

Conference_Location

Lake Tahoe, CA, USA

Print_ISBN

0-7803-7558-0

Type

conf

DOI

10.1109/IRWS.2002.1194222

Filename

1194222

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