• DocumentCode
    3389142
  • Title

    Analyzing and modeling on optimized L-ratio of evaporator section to condenser section for micro heat pipe heat sinks

  • Author

    Xiao Ping Wu ; Mochizuki, Masataka ; Saito, Yuji ; Nguyen, Thang ; Wuttijumnong, Vijit ; Wu, Xiao Ping

  • Author_Institution
    Fujikura America Inc., USA
  • fYear
    2003
  • fDate
    11-13 March 2003
  • Firstpage
    185
  • Lastpage
    190
  • Abstract
    This paper is focused on modeling and analysis on the determination of the optimized L-ratio, or Le/Lc, for the length of evaporator section to the length of condenser section of cylindrical heat pipes, for a heat sink in the horizontal position. The independent variables (for an equipped heat pipe on which all fixtures are firmed) in the function of the total thermal resistance are Le and Lc. Given the fact that this function has a local minimum between two fixed end points, the minimum extremal of the thermal resistance function can be obtained by taking the derivative of this functions and setting it to zero. Since the total length of a heat pipe, L, is constant, therefore Lc may be replaced by L-Le, then the differential equation can be solved. In this paper, a formula to analyze the optimal Le/Lc ratio is established. Table 2 to table 4 show analyzed results for diameters from 4 mm to 6 mm micro heat pipes in assemblies which are currently quite popular in applications.
  • Keywords
    condensation; cooling; evaporation; heat pipes; heat sinks; optimisation; thermal resistance; 2 mm; 3 mm; condenser length; cooling; evaporator length; evaporator/condenser section L-ratio; heat pipe L-ratio optimization; heat transfer; horizontally positioned heat sink; micro heat pipe heat sinks; thermal resistance minimum extremal; Australia; Bonding; Conducting materials; Fixtures; Heat sinks; Heat transfer; Resistance heating; Thermal conductivity; Thermal force; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-7793-1
  • Type

    conf

  • DOI
    10.1109/STHERM.2003.1194360
  • Filename
    1194360