DocumentCode
3389221
Title
Multi-objective design of liquid cooled power electronic modules for transient operation
Author
Kaczorowski, Przemyslaw R. ; Joshi, Yogendra ; Azarm, Shapour
Author_Institution
G.W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2003
fDate
11-13 March 2003
Firstpage
215
Lastpage
222
Abstract
A computationally efficient modeling framework for predicting and optimizing the thermal performance of liquid cooled power electronic modules has been developed to be used as a rapid scouting tool for preliminary layout designs. The framework is based on an integration of a compact multidimensional, transient thermal model with a genetic algorithm based multi-objective optimizer. By combining a simplified thermal impedance network model with the impulse response of multiple devices on a common substrate, an overall transient thermal assessment of a power electronic module can be performed. This methodology has been employed for analyzing power electronic modules that do not operate long enough to reach steady-state conditions. The modeling framework allows a designer to quickly identify potential optimal designs and perform detailed numerical simulations on them, rather than spend time searching for these optimal layouts through extensive computations.
Keywords
circuit optimisation; circuit simulation; cooling; genetic algorithms; modules; power electronics; thermal management (packaging); thermal resistance; transient response; common substrate mounted multiple devices; compact multidimensional transient thermal model; genetic algorithm; impulse response; liquid cooled power electronic modules; multi-objective design; multi-objective optimizer; thermal impedance network model; thermal performance optimization; transient electronic module operation; transient thermal assessment; Design optimization; Electronic packaging thermal management; Genetic algorithms; Impedance; Mechanical engineering; Power electronics; Temperature; Thermal conductivity; Thermal management of electronics; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
ISSN
1065-2221
Print_ISBN
0-7803-7793-1
Type
conf
DOI
10.1109/STHERM.2003.1194365
Filename
1194365
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