• DocumentCode
    3389221
  • Title

    Multi-objective design of liquid cooled power electronic modules for transient operation

  • Author

    Kaczorowski, Przemyslaw R. ; Joshi, Yogendra ; Azarm, Shapour

  • Author_Institution
    G.W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2003
  • fDate
    11-13 March 2003
  • Firstpage
    215
  • Lastpage
    222
  • Abstract
    A computationally efficient modeling framework for predicting and optimizing the thermal performance of liquid cooled power electronic modules has been developed to be used as a rapid scouting tool for preliminary layout designs. The framework is based on an integration of a compact multidimensional, transient thermal model with a genetic algorithm based multi-objective optimizer. By combining a simplified thermal impedance network model with the impulse response of multiple devices on a common substrate, an overall transient thermal assessment of a power electronic module can be performed. This methodology has been employed for analyzing power electronic modules that do not operate long enough to reach steady-state conditions. The modeling framework allows a designer to quickly identify potential optimal designs and perform detailed numerical simulations on them, rather than spend time searching for these optimal layouts through extensive computations.
  • Keywords
    circuit optimisation; circuit simulation; cooling; genetic algorithms; modules; power electronics; thermal management (packaging); thermal resistance; transient response; common substrate mounted multiple devices; compact multidimensional transient thermal model; genetic algorithm; impulse response; liquid cooled power electronic modules; multi-objective design; multi-objective optimizer; thermal impedance network model; thermal performance optimization; transient electronic module operation; transient thermal assessment; Design optimization; Electronic packaging thermal management; Genetic algorithms; Impedance; Mechanical engineering; Power electronics; Temperature; Thermal conductivity; Thermal management of electronics; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-7793-1
  • Type

    conf

  • DOI
    10.1109/STHERM.2003.1194365
  • Filename
    1194365