Multi-purpose EM test structure with electrical verification of the failure spot demonstrated using SWEAT for fast wafer level reliability monitoring

A multi-purpose electromigration test structure designed for advanced fast wafer level reliability tests is described in this work. It is shown that different failure location and failure modes can be detected electrically by this test structure which is beneficial for early technology development as well as productive in-line monitoring. A carefully designed test structure guarantees the ability to test for different electromigration failure modes (upstream, downstream). The presented experimental data focuses on the investigation of different process splits.