DocumentCode
3396343
Title
Including the impact of connecting vias in the performance metric evaluation for board-level optimization of decoupling capacitors
Author
Mondal, Mosin ; Connor, Samuel ; Archambeault, Bruce ; Jandhyala, Vikram
Author_Institution
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
177
Lastpage
180
Abstract
Existing decoupling capacitor optimization techniques tend to neglect the impact of via parasitics while evaluating the performance metrics. This work demonstrates that ignoring the impact of connecting vias can produce optimistic results leading to functional failure. An efficient method for including via-parasitics in the performance metric evaluation is presented for more accurate design optimization.
Keywords
capacitors; network synthesis; simulated annealing; board-level optimization; decoupling capacitor optimization techniques; design optimization; performance metric evaluation; simulated annealing; Design optimization; Frequency; Impedance; Joining processes; Measurement; Optimization methods; Paramagnetic resonance; Power capacitors; Simulated annealing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2873-1
Type
conf
DOI
10.1109/EPEP.2008.4675907
Filename
4675907
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