• DocumentCode
    3396423
  • Title

    Piezoelectricity of cross-linked polypropylene films treated by hot-stretching

  • Author

    Pan, Daosheng ; Zhang, Shuo ; Wang, Xuewen ; Cao, Gongxun ; Shuo Zhang ; Li, Hongqiang ; Xia, Zhongfu

  • Author_Institution
    Pohl Inst. of Solid State Phys., Tongji Univ., Shanghai, China
  • fYear
    2009
  • fDate
    19-23 July 2009
  • Firstpage
    1166
  • Lastpage
    1169
  • Abstract
    Piezoelectrets made by cross-linked polypropylene (XPP) foam sheet are prepared by hot-stretching process. The microstructure of stretched films is observed by SEM technique. The piezoelectric d33-coefficients of the samples, with various degrees of elongation, are determined by a quasi-static method. The applied pressure dependence of piezoelectric d33-coefficients is investigated. The influence of surface structure on piezoelectric activity is discussed also. The results show that the piezoelectricity starts at the degree of elongation 70%. The piezoelectric d33-coefficients are enhanced with the increase of elongation degree. The d33 value of 35pC/N is obtained for the sample stretched to elongation degree of 150%. All the samples show good linearity in the range of applied pressure up to 30 kPa. Improved piezoelectric activity was obtained for the stretched XPP films when the rough surfaces were exposed to corona.
  • Keywords
    piezoelectricity; polymer films; polymer insulators; SEM technique; crosslinked polypropylene films; foam sheet; hot-stretching; microstructure; piezoelectrets; piezoelectricity; Corona; Current measurement; Force measurement; Piezoelectric films; Piezoelectricity; Plasma temperature; Rough surfaces; Solids; Surface charging; Surface roughness; cross-linked polypropylene; electret; piezoelectricity; void structure;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-4367-3
  • Electronic_ISBN
    978-1-4244-4368-0
  • Type

    conf

  • DOI
    10.1109/ICPADM.2009.5252281
  • Filename
    5252281