High frequency loss characterization of FCPBGA package materials with humidity and temperature variation

As electronic device modules are operated in varying temperature and humidity conditions over cycles, package substrates experience material property changes including electrical characteristics in different environment conditions with electrical performance affected in particular at high frequencies. This paper presents temperature and moisture effect on electrical performance of high speed interconnects through raw material characterization and high frequency loss measurements on package interconnect. Measurements on raw material and differential test conductor structures show a great loss dependence on temperature and moisture with a significant loss increase in higher temperature and moisture condition at high frequencies The paper also discusses package loss budget to application space relation taking into account those effects in high speed designs.