DocumentCode
3396947
Title
Development of high power laser diode
Author
Ki-Young Um ; Ki-Gwan Han ; Jong-Moo Lee ; Soon-Chang Kwon ; Fun-Ah Lee ; Hwang-Jin Lee ; Min-Soo Noh ; Tae-Kyung Yoo
Author_Institution
LGIS R&D Center, Anyang, South Korea
Volume
2
fYear
1999
fDate
Aug. 30 1999-Sept. 3 1999
Firstpage
225
Abstract
We have recently observed that laser diodes operate firmly with high power and long lifetime at room temperature. This high power laser diodes can be properly used for micro-heating, micro-welding, soldering, material processing, medical applications, and pumping solid state laser. In the study, we report several significant characteristics of Al-free laser diodes through packaging the chips produced at LG CIT. The active layer of the laser diodes consists of InGaAsP and the structure is gain-guided and single quantum well. Al-free laser diodes not having COD (catastrophic optical damage) caused from Al oxidation have longer lifetimes and less opportunities to make initial failure when compared to AlGaAs laser diodes. The width of experimental laser diodes is 1 cm, with cavity length 0.5 mm and thickness 120 /spl mu/m.
Keywords
III-V semiconductors; gallium arsenide; gallium compounds; indium compounds; laser beams; optical fabrication; quantum well lasers; 0.5 mm; 1 cm; 120 mum; Al oxidation; Al-free laser diodes; AlGaAs laser diodes; InGaAsP; active layer; catastrophic optical damage; cavity length; chips; gain-guided laser; high power laser; high power laser diode; initial failure; laser diode facets; laser diodes; long lifetime laser; material processing; medical applications; micro-heating; micro-welding; packaging; pumping; room temperature; single quantum well laser; soldering; solid state laser; thickness; Biomedical equipment; Biomedical optical imaging; Diode lasers; Laser excitation; Materials processing; Medical services; Packaging; Soldering; Solid lasers; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics, 1999. CLEO/Pacific Rim '99. The Pacific Rim Conference on
Conference_Location
Seoul, South Korea
Print_ISBN
0-7803-5661-6
Type
conf
DOI
10.1109/CLEOPR.1999.811385
Filename
811385
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