DocumentCode
3397046
Title
Packaging modeling using fast broadband surface integral equation method
Author
Qian, Zhi Guo ; Chew, Weng Cho
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
347
Lastpage
350
Abstract
The augmented electric field integral equation with frequency scaling provides a stable formulation over broad frequency band. With the iterative solver and the mixed-form fast multipole algorithm, large scale packaging problems can be solved efficiently.
Keywords
electronics packaging; iterative methods; iterative solver; large scale packaging problems; mixed-form fast multipole algorithm; packaging modeling; surface integral equation method; Acceleration; Electric breakdown; Frequency; Integral equations; Iterative algorithms; Iterative methods; Large-scale systems; Matrix decomposition; Packaging; Physics;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2873-1
Type
conf
DOI
10.1109/EPEP.2008.4675952
Filename
4675952
Link To Document