• DocumentCode
    3397292
  • Title

    Polyaniline/poly(vinylidene fluoride) functional hybrid films with high electric energy density

  • Author

    Yuan, Jinkai ; Yao, Shenghong ; Dang, Zhimin ; Bai, Jinbo

  • Author_Institution
    Key Lab. of Beijing City for Preparation & Possessing of Novel Polymer Mater., Beijing Univ. of Chem. Technol., Beijing, China
  • fYear
    2009
  • fDate
    19-23 July 2009
  • Firstpage
    737
  • Lastpage
    740
  • Abstract
    To obtain the dielectric capacitor composites, poly(vinylidene fluoride) and conductive polyaniline were selected as the polymer matrix and the filler respectively. The influence of filler contents on the dielectric properties was studied. The results showed that when the polyaniline content was up to 0.05, the dielectric permittivity of the hybrid film was as high as 457 (at 100 Hz), the breakdown strength was 60 MV/m, and the energy density was 7.2 J/cm3, which was three times larger than that of neat matrix. The result of SEM revealed that polyaniline can disperse uniformly in the matrix, The percolative theory and microcapacitor model were employed to explain the results. This route was demonstrated to be effective to prepare high energy density capacitor materials.
  • Keywords
    capacitors; conducting polymers; dielectric materials; permittivity; polymer films; scanning electron microscopy; SEM; breakdown strength; capacitor material; conductive polyaniline; dielectric capacitor composite; dielectric permittivity; electric energy density; filler; frequency 100 Hz; functional hybrid film; microcapacitor model; percolative theory; polymer matrix; polyvinylidene fluoride; Capacitors; Conducting materials; Dielectric devices; Dielectric losses; Dielectric materials; Dielectric substrates; Dielectric thin films; Electric breakdown; Permittivity; Polymer films; all-organic; conductive polyaniline; high energy density; hybrid films; poly(vinylidene fluoride);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-4367-3
  • Electronic_ISBN
    978-1-4244-4368-0
  • Type

    conf

  • DOI
    10.1109/ICPADM.2009.5252325
  • Filename
    5252325