Object-oriented thermal placement using an accurate heat model

An MCM\´s increased throughput and dense circuitry can easily result in failure if the board contains "hot spots". Therefore, an accurate thermal model of an MCM was needed in the development of a new placement algorithm designed to consider both total net length and heat constraints. This algorithm uses a combination of simulated evolution and simulated annealing in an iterative approach. The fitness method evaluates the maximum heat for each chip, considering the chip\´s own heat and the heat from surrounding chips at its hottest point. Results are shown and comparisons are drawn to other placement algorithms.