• DocumentCode
    3398283
  • Title

    Overview of 3D NAND Flash and progress of vertical gate (VG) architecture

  • Author

    Hang-Ting Lue ; Shih-Hung Chen ; Yen-Hao Shih ; Kuang-Yeu Hsieh ; Chih-Yuan Lu

  • Author_Institution
    Macronix Int. Co., Ltd., Hsinchu, Taiwan
  • fYear
    2012
  • fDate
    Oct. 29 2012-Nov. 1 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper provides an overview of 3D NAND Flash memory architecture and a comprehensive study on various array decoding methods of vertical gate (VG) NAND Flash. A certain memory density may be achieved by any array architecture but with different numbers of stacking layers. A smaller pitch allows the achieving of high density at reasonable number of stacked memory layers (≤ 32) and thus potentially offers lower cost. VG NAND has good pitch scalability thus is very attractive. On the other hand, it is more difficult to decode the bit line in a VG architecture, thus decoding innovations are required for a compact array architecture design. This paper provides a systematic comparison of four different decoding methods of VG NAND. Performance of the TFT BE-SONOS device used in 3D VG NAND is also addressed.
  • Keywords
    NAND circuits; decoding; flash memories; logic arrays; three-dimensional integrated circuits; 3D NAND flash; TFT BE-SONOS device; array decoding method; memory density; vertical gate NAND; vertical gate architecture; Arrays; Decoding; Flash memory; Logic gates; Microprocessors; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4673-2474-8
  • Type

    conf

  • DOI
    10.1109/ICSICT.2012.6466681
  • Filename
    6466681