DocumentCode
3399099
Title
BBE: hierarchical computation of 3-D interconnect capacitance with BEM block extraction
Author
Lu, Taotao ; Wang, Zeyi ; Hong, Xianlong
Author_Institution
Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
fYear
2003
fDate
21-24 Jan. 2003
Firstpage
255
Lastpage
260
Abstract
Fast and accurate interconnect parasitic parameter extraction has become increasingly critical for verification and analysis in VLSI. In this paper, a fast hierarchical extraction approach based on the boundary element method (BEM) is presented for 3D parasitic capacitance computation. Hierarchical partition of the 3D field creates many parts which are called 3D BEM blocks. After combining all the 3D BEM blocks, the capacitance matrix for a given set of nets can be computed by applying the boundary conditions. Numerical results shows that this method performs many times faster than the 3D field solver, with equal accuracy.
Keywords
VLSI; boundary-elements methods; capacitance; circuit CAD; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; logic partitioning; 3D BEM blocks; 3D field solver; 3D interconnect capacitance; 3D parasitic capacitance computation; BBE; BEM block extraction; VLSI; boundary conditions; boundary element method; capacitance matrix; design verification; hierarchical computation; hierarchical partition; interconnect parasitic parameter extraction; Boundary conditions; Boundary element methods; Clocks; Computer science; Delay systems; Frequency; Laplace equations; Parameter extraction; Parasitic capacitance; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2003. Proceedings of the ASP-DAC 2003. Asia and South Pacific
Print_ISBN
0-7803-7659-5
Type
conf
DOI
10.1109/ASPDAC.2003.1195026
Filename
1195026
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