• DocumentCode
    3399099
  • Title

    BBE: hierarchical computation of 3-D interconnect capacitance with BEM block extraction

  • Author

    Lu, Taotao ; Wang, Zeyi ; Hong, Xianlong

  • Author_Institution
    Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
  • fYear
    2003
  • fDate
    21-24 Jan. 2003
  • Firstpage
    255
  • Lastpage
    260
  • Abstract
    Fast and accurate interconnect parasitic parameter extraction has become increasingly critical for verification and analysis in VLSI. In this paper, a fast hierarchical extraction approach based on the boundary element method (BEM) is presented for 3D parasitic capacitance computation. Hierarchical partition of the 3D field creates many parts which are called 3D BEM blocks. After combining all the 3D BEM blocks, the capacitance matrix for a given set of nets can be computed by applying the boundary conditions. Numerical results shows that this method performs many times faster than the 3D field solver, with equal accuracy.
  • Keywords
    VLSI; boundary-elements methods; capacitance; circuit CAD; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; logic partitioning; 3D BEM blocks; 3D field solver; 3D interconnect capacitance; 3D parasitic capacitance computation; BBE; BEM block extraction; VLSI; boundary conditions; boundary element method; capacitance matrix; design verification; hierarchical computation; hierarchical partition; interconnect parasitic parameter extraction; Boundary conditions; Boundary element methods; Clocks; Computer science; Delay systems; Frequency; Laplace equations; Parameter extraction; Parasitic capacitance; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2003. Proceedings of the ASP-DAC 2003. Asia and South Pacific
  • Print_ISBN
    0-7803-7659-5
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2003.1195026
  • Filename
    1195026