Packaging of two-dimensional smart pixel arrays

The optomechanical and electronic packaging of two-dimensional smart pixel arrays present a series of constraints that complicate the application of standard electrical packaging approaches in system applications. Through the construction of demonstrator systems, we have designed, fabricated, and implemented smart pixel packaging which uniquely addresses the critical issues associated with successfully integrating two-dimensional optoelectronic device arrays into systems. In order to take full advantage of this class of optoelectronics, aggressive packaging solutions which use both existing and new microelectronic packaging technologies have been employed. Key system design considerations such as electrical bandwidth and connectivity, thermal management, and optical alignability have played a role in the choice of packaging solution. In this paper, we will describe smart pixel packaging designed, modelled, fabricated and demonstrated for board-to-board optical interconnect applications.