DocumentCode
3401963
Title
A sensor skin using wire-free tactile sensing elements based on optical connection
Author
Yamada, Kouichi ; Goto, Kenji ; Nakajima, Yoshiki ; Koshida, Nobuyoshi ; Shinoda, Hiroyuki
Author_Institution
Tokyo Univ. of Agric. & Technol., Japan
Volume
1
fYear
2002
fDate
5-7 Aug. 2002
Firstpage
131
Abstract
A key to realize an elastic sensor skin that covers the entire body of machines is removing metal wires to tactile sensing elements. Using wireless tactile sensing chips based on RF connection is a hopeful method, which was proposed recently. However, it is difficult to make the RF tactile sensing element smaller than several millimeters because the energy transmission efficiency decreases as the chip size decreases. In this paper we propose a wireless tactile sensing element based on optical connection. The sensing chip with 1 mm cubic shape operates with optical power, and sends optical codes of 6 stress components measured by an optical sensing method. We describe the chip design and the 6 stress sensing principle, and show experimental results of the stress sensing using a prototype of a 4 mm cubic chip. Then we estimated the required optical power for the sensing chip, and checked the operation of the digital circuit on the chip.
Keywords
optical sensors; tactile sensors; RF connection; RF tactile sensing element; digital circuit; elastic sensor skin; energy transmission efficiency; metal wires; optical connection; radiofrequency connection; stress components; wire-free tactile sensing elements; wireless tactile sensing chips; Optical devices; Optical sensors; Power measurement; Radio frequency; Shape measurement; Skin; Stress; Tactile sensors; Wireless sensor networks; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
SICE 2002. Proceedings of the 41st SICE Annual Conference
Print_ISBN
0-7803-7631-5
Type
conf
DOI
10.1109/SICE.2002.1195198
Filename
1195198
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