• DocumentCode
    3405748
  • Title

    An efficient methodology for extraction and simulation of transmission lines for application specific electronic modules

  • Author

    Kim, S.Y. ; Tuncer, E. ; Gupta, R. ; Krauter, B. ; Savarino, T. ; Neikirk, D.P. ; Pillage, L.T.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
  • fYear
    1993
  • fDate
    7-11 Nov. 1993
  • Firstpage
    58
  • Lastpage
    65
  • Abstract
    Physical interconnect introduces new challenges for parameter extraction and delay calculation for application specific electronic module (ASEM) design automation. Efficiency dictates the precharacterization of extracted electrical parameters in the same manner as application specific integrated circuits (ASICs). However, ASEM interconnect is dominated by frequency dependent LC propagation which makes precharacterization difficult for all possible configurations. Moreover, simulating the transient behavior of the ASEM interconnect for noise and delay analysis requires the combined use of a variety of models and techniques for efficiently handling lossy, low-loss, frequency dependent, and coupled transmission lines together with lumped parasitic elements. We propose to use conformal mapping to generate "abstracted" models for the electrical parameters of various RLC interconnect cross-sections, including the frequency dependence caused by ground plane proximity and skin effects. Along with precharacterized lumped parasitic elements and nonlinear driver and load models, these models are simulated using a generalized time-domain macromodeling approach that can combine different types of transmission line analysis in one simulation environment. An automatic selection mechanism is derived for determination of the best time-domain macromodel for a particular distributed segment.
  • Keywords
    application specific integrated circuits; ASEM interconnect; ASICs; RLC interconnect cross-sections; application specific electronic module; application specific electronic modules; application specific integrated circuits; automatic selection mechanism; conformal mapping; delay calculation; design automation; distributed segment; extracted electrical parameters; frequency dependent LC propagation; generalized time-domain macromodeling approach; ground plane proximity; lumped parasitic elements; parameter extraction; precharacterization; skin effects; time-domain macromodel; transient behavior; transmission line analysis; transmission lines; Analytical models; Circuit simulation; Delay; Design automation; Frequency dependence; Integrated circuit interconnections; Load modeling; Parameter extraction; Time domain analysis; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 1993. ICCAD-93. Digest of Technical Papers., 1993 IEEE/ACM International Conference on
  • Conference_Location
    Santa Clara, CA, USA
  • Print_ISBN
    0-8186-4490-7
  • Type

    conf

  • DOI
    10.1109/ICCAD.1993.580031
  • Filename
    580031