DocumentCode
3407938
Title
Progress in device processing for advanced ULSI-impact on lithography
Author
Saitou, Norio
Author_Institution
Central Res. Lab., Hitachi Ltd., Tokyo, Japan
Volume
1
fYear
1999
fDate
1999
Firstpage
8
Abstract
The semiconductor industry is now facing a major crisis because optical lithography will be reaching its cost effective limits near 130-100 nm design rule around the year 2003. This paper discusses the limit of current optical lithography and the world wide trends in developing post-optical lithographic processes
Keywords
ULSI; lithography; photolithography; semiconductor technology; advanced ULSI; cost effective limits; device processing; lithography; optical lithography; post-optical lithographic processes; semiconductor industry; Chemical technology; Costs; Dielectric materials; Electron optics; Etching; Ion beams; Lithography; Particle beam optics; Ultra large scale integration; Ultraviolet sources;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology Proceedings, 1998 International Conference on
Conference_Location
Kyoto
Print_ISBN
0-7803-4538-X
Type
conf
DOI
10.1109/IIT.1999.812039
Filename
812039
Link To Document