DocumentCode
3408021
Title
3D polymer microneedle array: Fabrication and analysis
Author
Shewale, J.J. ; Bhole, K.S.
Author_Institution
Dept. of Mech. Eng., Datta Meghe Coll. of Eng., Airoli, India
fYear
2015
fDate
9-10 Jan. 2015
Firstpage
1
Lastpage
6
Abstract
A lot of research has been done on the development of Microneedles (MNs) to be used as medical devices with an aim to have painless transdermal drug and improved vaccine delivery. Unlike conventional intramuscular or subcutaneous application, MN-based vaccine application delivers vaccine directly into skin and this is known to be immunologically more relevant vaccination site than underlying tissue. Various fabrication methods have been used for microneedle fabrication such as LIGA, 2 Photon Polymerization (2PP), etc. followed by subsequent Micromolding. However, despite the number of advantages of these fabrication methods, the use of microneedles is limited till date due to lesser throughput. This paper focuses on methods used for the fabrication of microneedle and also explains the proposed method for polymer microneedle fabrication using Micromolding process. Proposed method for polymer microneedle fabrication includes preparing a master structure of microneedle array, then with the help of micromold made of suitable material; final microneedle array can be made of biocompatible, thermally curable material. The microneedle array will meet the structural requirements for painless drug delivery having small invasive surface area and will withstand the force required to pierce into the skin without tip breaking.
Keywords
medical supplies; micromechanical devices; moulding; needles; polymers; 3D polymer microneedle array; biocompatible material; invasive surface area; micromolding process; painless drug delivery; polymer microneedle fabrication; thermally curable material; Arrays; Fabrication; Photonics; Polymers; Silicon; Skin;
fLanguage
English
Publisher
ieee
Conference_Titel
Nascent Technologies in the Engineering Field (ICNTE), 2015 International Conference on
Conference_Location
Navi Mumbai
Print_ISBN
978-1-4799-7261-6
Type
conf
DOI
10.1109/ICNTE.2015.7029915
Filename
7029915
Link To Document