• DocumentCode
    3408021
  • Title

    3D polymer microneedle array: Fabrication and analysis

  • Author

    Shewale, J.J. ; Bhole, K.S.

  • Author_Institution
    Dept. of Mech. Eng., Datta Meghe Coll. of Eng., Airoli, India
  • fYear
    2015
  • fDate
    9-10 Jan. 2015
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A lot of research has been done on the development of Microneedles (MNs) to be used as medical devices with an aim to have painless transdermal drug and improved vaccine delivery. Unlike conventional intramuscular or subcutaneous application, MN-based vaccine application delivers vaccine directly into skin and this is known to be immunologically more relevant vaccination site than underlying tissue. Various fabrication methods have been used for microneedle fabrication such as LIGA, 2 Photon Polymerization (2PP), etc. followed by subsequent Micromolding. However, despite the number of advantages of these fabrication methods, the use of microneedles is limited till date due to lesser throughput. This paper focuses on methods used for the fabrication of microneedle and also explains the proposed method for polymer microneedle fabrication using Micromolding process. Proposed method for polymer microneedle fabrication includes preparing a master structure of microneedle array, then with the help of micromold made of suitable material; final microneedle array can be made of biocompatible, thermally curable material. The microneedle array will meet the structural requirements for painless drug delivery having small invasive surface area and will withstand the force required to pierce into the skin without tip breaking.
  • Keywords
    medical supplies; micromechanical devices; moulding; needles; polymers; 3D polymer microneedle array; biocompatible material; invasive surface area; micromolding process; painless drug delivery; polymer microneedle fabrication; thermally curable material; Arrays; Fabrication; Photonics; Polymers; Silicon; Skin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nascent Technologies in the Engineering Field (ICNTE), 2015 International Conference on
  • Conference_Location
    Navi Mumbai
  • Print_ISBN
    978-1-4799-7261-6
  • Type

    conf

  • DOI
    10.1109/ICNTE.2015.7029915
  • Filename
    7029915