Experimental results and modeling of noise coupling in a lightly doped substrate

While an in-depth experimental study of substrate noise coupling in an epi process has been reported, most research into substrate coupling in lightly doped bulk wafers has been limited to simulations without experimental confirmation. This work presents experimental noise coupling data for a lightly doped substrate, along with corresponding simulation results obtained using a compact model of the substrate. The results of this work provide a general understanding of noise coupling in lightly doped substrates and emphasize the layout dependence of such noise. Without an efficient simulation capability utilizing a compact model of the substrate, it is extremely difficult to predict how noise will couple to a circuit node.