DocumentCode
3414183
Title
Microelectronics design for pollution prevention: a decision tradeoff tool
Author
Alvarado, Jorge L. ; Thurston, Deborah L.
Author_Institution
Dept. of Gen. Eng., Illinois Univ., Urbana, IL, USA
fYear
1998
fDate
4-6 May 1998
Firstpage
292
Lastpage
297
Abstract
After exhausting all “pollution prevention pays” opportunities, further efforts towards environmental protection often engender some type of cost to the manufacturer. Then, designers must weigh tradeoffs between environmental impacts and equally pressing needs to reduce rests, improve product quality and reduce cycle time. This paper presents a computer aid for making these tradeoffs. Qualitative House of Quality (HOQ) information is used as a starting point to derive a mathematical programming formulation for multiobjective optimization. An integer linear program is formulated in a user-friendly spreadsheet. A general formulation of the problem for printed circuit board assembly is provided. The conflicting objectives include cost, size, weight, quality, cycle time, disassembly time and solvent VOC´s. The decision variables relate to number of layers, board width, board type and types of components
Keywords
CAD; design engineering; electronic engineering computing; integrated circuit design; linear programming; pollution; printed circuit design; spreadsheet programs; PCB assembly; computer aid; cycle time; decision tradeoff tool; disassembly time; environmental protection; house of quality information; integer linear program; mathematical programming formulation; microelectronics design; multiobjective optimization; pollution prevention; printed circuit board assembly; user-friendly spreadsheet; Assembly; Costs; Environmentally friendly manufacturing techniques; Mathematical programming; Microelectronics; Pollution; Pressing; Printed circuits; Protection; Solvents;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and the Environment, 1998. ISEE-1998. Proceedings of the 1998 IEEE International Symposium on
Conference_Location
Oak Brook, IL
ISSN
1095-2020
Print_ISBN
0-7803-4295-X
Type
conf
DOI
10.1109/ISEE.1998.675074
Filename
675074
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