• DocumentCode
    3416070
  • Title

    Implementation of On-Chip and On-Package Reactive Equalizer to Minimize Inter-symbol Interference (ISI) and Jitter from Frequency Dependent Attenuation

  • Author

    Ahn, Seungyoung ; Chun, Jongtae ; Kim, Joungho

  • Author_Institution
    Samsung Electron., Suwon
  • fYear
    2007
  • fDate
    9-13 July 2007
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In this paper, on-chip and on-package reactive equalizer schemes that minimize inter-symbol interference (ISI) and jitter are proposed. The proposed reactive equalizers are designed and optimized in a frequency domain for 3 Gbps signaling on a transmission line with frequency dependent loss and parasitic capacitance. The proposed reactive equalizer was implemented using a 0.18 um CMOS process, and verification of improvements in the signal quality was performed via simulation and measurement of the time domain reflection and an eye diagram.
  • Keywords
    CMOS integrated circuits; equalisers; frequency-domain analysis; integrated circuit packaging; intersymbol interference; jitter; time-domain analysis; CMOS process; frequency dependent attenuation; intersymbol interference minimisation; jitter; on-package reactive equalizer; transmission line; Attenuation; Design optimization; Equalizers; Frequency dependence; Frequency domain analysis; Intersymbol interference; Jitter; Parasitic capacitance; Propagation losses; Signal design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    1-4244-1349-4
  • Electronic_ISBN
    1-4244-1350-8
  • Type

    conf

  • DOI
    10.1109/ISEMC.2007.59
  • Filename
    4305639