Class D digital power amp (PurePath Digital™) high Q musical content

Author

Neesgaard, C. ; Antley, R. ; Efland, T. ; Kaya, C. ; Mochizuki, K. ; Nyboe, F. ; Risbo, L. ; Skelton, D. ; Unnikirishnan ; Zhao, A.

Author_Institution

High Performance Analog, Digital Audio Products, Texas Instrum. Inc., Dallas, TX, USA

fYear

2004

fDate

24-27 May 2004

Firstpage

97

Lastpage

100

Abstract

The complex aspects of digital class D audio amplification and related technology issues are discussed. The focus is on a 100 W into 4 Ω bridge-tied-load (BTL) power stage PIC. A 0.35 μm BCD technology (LBC5) having 50 V LDMOS, and 10 μm plated CuNiPd power metal, with bonding capability, was used to fabricate the chip.

Keywords

BiCMOS integrated circuits; audio-frequency amplifiers; copper alloys; integrated circuit metallisation; nickel alloys; palladium alloys; power MOSFET; power amplifiers; power integrated circuits; 0.35 micron; 10 micron; 100 W; 4 ohm; 50 V; BCD technology; CuNiPd; LDMOS; PurePath Digital amplifier; bonding capability plated power metal; bridge-tied-load power stage; class D digital power amplifier; high quality music amplifier; musical signals; power audio amplifier; Audio amplifiers; BiCMOS integrated circuits; Copper alloys; Integrated circuit metallization; Nickel alloys; Palladium alloys; Power MOSFETs; Power amplifiers; Power integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Semiconductor Devices and ICs, 2004. Proceedings. ISPSD '04. The 16th International Symposium on

Print_ISBN

4-88686-060-5

Type

conf

DOI

10.1109/ISPSD.2004.1332868

Filename

1332868