DocumentCode
3416561
Title
Performance improvement by stack structure in flexible resistive random access memory
Author
Run-chen Fang ; Wen Yang ; Qing-Qing Sun ; Peng Zhou ; Peng-Fei Wang ; Zhang, David Wei
Author_Institution
Dept. of Microelectron., Fudan Univ., Shanghai, China
fYear
2012
fDate
Oct. 29 2012-Nov. 1 2012
Firstpage
1
Lastpage
3
Abstract
Resistive random access memory (RRAM) has been widely investigated. However, for the applications in flexible electronics, this type of memory is not so widely investigated for its requirement of the low processing temperature. In this paper, we demonstrated an Al2O3-based FRRAM fabricated under low temperature, and improved its performance by utilizing Al2O3/HfO2 functional stack.
Keywords
aluminium compounds; flexible electronics; hafnium compounds; random-access storage; Al2O3-HfO2; FRRAM; flexible electronics; flexible resistive random access memory; low temperature fabrication; performance improvement; stack structure; Aluminum oxide; Flexible electronics; Hafnium compounds; Resistance; Switches; Temperature; Temperature measurement; Aluminum oxide; FRRAM; Hafnium oxide; High uniformity; LTALD;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4673-2474-8
Type
conf
DOI
10.1109/ICSICT.2012.6467657
Filename
6467657
Link To Document