DocumentCode
3416749
Title
Proceedings 1997 International Conference on Multichip Modules
fYear
1997
fDate
2-4 April 1997
Abstract
The following topics were dealt with. Markets and infrastructure; MCM-C; MCM-D; MCM-L; flip chip technology; packaging materials; interconnect technologies; substrate processing; known good die; modelling; and integrated passives
Keywords
flip-chip devices; integrated circuit interconnections; integrated circuit packaging; multichip modules; MCM-C; MCM-D; MCM-L; flip chip technology; integrated passives; interconnect technologies; known good die; markets; modelling; packaging materials; substrate processing;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules, 1997., International Conference on
Conference_Location
Denver, CO, USA
Print_ISBN
0-7803-3787-5
Type
conf
DOI
10.1109/ICMCM.1997.581135
Filename
581135
Link To Document