• DocumentCode
    3417180
  • Title

    Enhancing performance of network-on-chip architectures with millimeter-wave wireless interconnects

  • Author

    Deb, Sujay ; Ganguly, Amlan ; Chang, Kevin ; Pande, Partha ; Beizer, B. ; Heo, Deuk

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Washington, DC, USA
  • fYear
    2010
  • fDate
    7-9 July 2010
  • Firstpage
    73
  • Lastpage
    80
  • Abstract
    In a traditional Network-on-Chip (NoC), latency and power dissipation increase with system size due to its inherent multi-hop communications. The performance of NoC communication fabrics can be significantly enhanced by introducing long-range, low power, high bandwidth direct links between far apart cores. In this paper a design methodology for a scalable hierarchical NoC with on-chip millimeter (mm)-wave wireless links is proposed. The proposed wireless NoC offers significantly higher throughput and lower energy dissipation compared to its conventional multi-hop wired counterpart. It is also demonstrated that the proposed hierarchical NoC with long range wireless links shows significant performance gains in presence of various application-specific traffic and multicast scenarios.
  • Keywords
    Bandwidth; Delay; Design methodology; Fabrics; Millimeter wave communication; Millimeter wave technology; Network-on-a-chip; Power dissipation; Power system interconnection; Spread spectrum communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Application-specific Systems Architectures and Processors (ASAP), 2010 21st IEEE International Conference on
  • Conference_Location
    Rennes, France
  • ISSN
    2160-0511
  • Print_ISBN
    978-1-4244-6966-6
  • Electronic_ISBN
    2160-0511
  • Type

    conf

  • DOI
    10.1109/ASAP.2010.5540799
  • Filename
    5540799