• DocumentCode
    3417419
  • Title

    Estimation of switching noise on power supply lines in deep sub-micron CMOS circuits

  • Author

    Zhao, Shiyou ; Roy, Kaushik

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    168
  • Lastpage
    173
  • Abstract
    To achieve high performance and high integration density, the transistor dimensions are aggressively scaled down while lower power dissipation is achieved by scaling down the supply voltage. However, power distribution has become a challenging issue due to the severe switching noise on the power distribution network. Estimation of the worst case switching noise is essential to ensure the proper functionality of the VLSI circuits. In this paper, we propose a probabilistic approach to determine the lower bound of the worst case switching noise on power supply lines. The proposed algorithm traces the worst case input patterns which will induce the steepest maximum switching current spike and therefore the maximum switching noise. The worst case input patterns are used in the HSPICE simulation to extract the exact switching current waveforms. The estimated maximum switching current spike matches well with the peak current obtained from the HSPICE simulation. The worst case switching noise due to the lumped inductance (including the packaging inductance) and the lumped resistance on the power supply grid is also extracted from the HSPICE simulation. The magnitude of the worst case switching noise for the benchmark circuits implemented with 0.25 μm technology can be as high as 35% of the Vdd. The switching noise can be suppressed effectively with properly placed decoupling capacitors
  • Keywords
    CMOS integrated circuits; SPICE; VLSI; circuit simulation; inductance; integrated circuit design; integrated circuit noise; integrated circuit packaging; low-power electronics; 0.25 micron; HSPICE simulation; VLSI circuits; benchmark circuits; decoupling capacitors; deep sub-micron CMOS circuits; integration density; lumped inductance; lumped resistance; packaging inductance; power dissipation; power distribution; power supply lines; probabilistic approach; supply voltage; switching noise; worst case input patterns; Circuit noise; Circuit simulation; Inductance; Power dissipation; Power distribution; Power supplies; Power systems; Switching circuits; Very large scale integration; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, 2000. Thirteenth International Conference on
  • Conference_Location
    Calcutta
  • ISSN
    1063-9667
  • Print_ISBN
    0-7695-0487-6
  • Type

    conf

  • DOI
    10.1109/ICVD.2000.812604
  • Filename
    812604