DocumentCode
3417419
Title
Estimation of switching noise on power supply lines in deep sub-micron CMOS circuits
Author
Zhao, Shiyou ; Roy, Kaushik
Author_Institution
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
fYear
2000
fDate
2000
Firstpage
168
Lastpage
173
Abstract
To achieve high performance and high integration density, the transistor dimensions are aggressively scaled down while lower power dissipation is achieved by scaling down the supply voltage. However, power distribution has become a challenging issue due to the severe switching noise on the power distribution network. Estimation of the worst case switching noise is essential to ensure the proper functionality of the VLSI circuits. In this paper, we propose a probabilistic approach to determine the lower bound of the worst case switching noise on power supply lines. The proposed algorithm traces the worst case input patterns which will induce the steepest maximum switching current spike and therefore the maximum switching noise. The worst case input patterns are used in the HSPICE simulation to extract the exact switching current waveforms. The estimated maximum switching current spike matches well with the peak current obtained from the HSPICE simulation. The worst case switching noise due to the lumped inductance (including the packaging inductance) and the lumped resistance on the power supply grid is also extracted from the HSPICE simulation. The magnitude of the worst case switching noise for the benchmark circuits implemented with 0.25 μm technology can be as high as 35% of the Vdd. The switching noise can be suppressed effectively with properly placed decoupling capacitors
Keywords
CMOS integrated circuits; SPICE; VLSI; circuit simulation; inductance; integrated circuit design; integrated circuit noise; integrated circuit packaging; low-power electronics; 0.25 micron; HSPICE simulation; VLSI circuits; benchmark circuits; decoupling capacitors; deep sub-micron CMOS circuits; integration density; lumped inductance; lumped resistance; packaging inductance; power dissipation; power distribution; power supply lines; probabilistic approach; supply voltage; switching noise; worst case input patterns; Circuit noise; Circuit simulation; Inductance; Power dissipation; Power distribution; Power supplies; Power systems; Switching circuits; Very large scale integration; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, 2000. Thirteenth International Conference on
Conference_Location
Calcutta
ISSN
1063-9667
Print_ISBN
0-7695-0487-6
Type
conf
DOI
10.1109/ICVD.2000.812604
Filename
812604
Link To Document