Motorola fast static RAM known good die manufacturing process

Author

Kost, Don ; Benner, Tony ; Corona, Christina ; Leal, Carlos ; Robinson, Dale ; Ward, Valerie ; Wilson, James

Author_Institution

Motorola Inc., Austin, TX, USA

fYear

1997

fDate

2-4 Apr 1997

Firstpage

245

Lastpage

249

Abstract

The Motorola fast static RAM division has put in place a manufacturing process for both wirebond and flip chip known good die (KGD). The goal was to manufacture KGD with the same quality and reliability as conventionally packaged die. A die level KGD process was developed which allows the reuse of the same equipment, manufacturing and quality infrastructure which is used for conventional package types. The paper discusses infrastructure reuse as it relates to the manufacturing KGD process, manufacturing flow and the process and quality procedures used to insure delivery of cost effective KGD

Keywords

SRAM chips; flip-chip devices; integrated circuit packaging; integrated circuit reliability; lead bonding; multichip modules; quality control; die level KGD process; fast static RAM; flip chip; infrastructure reuse; known good die manufacturing process; manufacturing flow; quality infrastructure; quality procedures; reliability; wirebond; Bonding; Contacts; Costs; Manufacturing processes; Multichip modules; Packaging machines; Semiconductor device manufacture; Semiconductor device testing; Substrates; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1997., International Conference on

Conference_Location

Denver, CO

Print_ISBN

0-7803-3787-5

Type

conf

DOI

10.1109/ICMCM.1997.581183

Filename

581183