85°C and 125°C probe with enhanced reliability screens (activities of the Sematech PTAB for die level product assurance)

Author

Arnold, Richard ; Brackett, B. ; Siddiqui, Sid ; Wong, Mike

Author_Institution

Texas Instrum. Inc., Midland, TX, USA

fYear

1997

fDate

2-4 Apr 1997

Firstpage

250

Lastpage

258

Abstract

The Sematcch Die Level Product Assurance Team is working to build a model for how hot chuck probing and enhanced reliability technologies can be combined to produce a KGD that is equivalent to the packaged part, The model consists of hot chuck probe card availability, hot chuck probe metrology, enhanced reliability screens, production plans, and quality standards. The Sematech member companies will help drive the standards for what is referred to as “Quality 2” KGD. The Quality 2 KGD will have the same quality and reliability as a packaged part, but different process tactics will be utilized to achieve the same product quality level. The objective of this paper is to acquaint the members of the MCM community with the activities of the Sematech team and update the conference of the project status. The team´s roadmap is also discussed

Keywords

integrated circuit measurement; integrated circuit reliability; integrated circuit testing; multichip modules; probes; quality control; 125 degC; 85 degC; KGD; MCM community; Quality 2; Sematech PTAB; die level product assurance; hot chuck probing; probe card availability; probe metrology; product quality level; production plans; project status; quality standards; reliability screens; Costs; Government; Manufacturing; Multichip modules; Packaging; Performance evaluation; Probes; Production; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1997., International Conference on

Conference_Location

Denver, CO

Print_ISBN

0-7803-3787-5

Type

conf

DOI

10.1109/ICMCM.1997.581185

Filename

581185