DocumentCode
3417653
Title
A very simple analytical approach of thermal modeling for magnetic components
Author
Escribano, L.M. ; Zumel, P. ; Prieto, R. ; Oliver, J.A. ; Cobos, J.A.
Author_Institution
Div. de Ingenieria Electron., Univ. Politecnica de Madrid, Spain
Volume
3
fYear
2005
fDate
6-10 March 2005
Firstpage
1944
Abstract
This work is focused on the analysis of an analytical thermal model for magnetic components. This model can be used to predict the average temperature rise in the outer surface of the device using a very simple expression. The application scope of the model is shown from a practical point of view. An analytical procedure to calculate its parameters is proposed. Finally, the model has been validated using finite element analysis and measurements.
Keywords
finite element analysis; magnetic devices; thermal analysis; analytical thermal model; finite element analysis; magnetic component; Electronic packaging thermal management; Equations; Filling; Finite element methods; Magnetic analysis; Magnetic cores; Predictive models; Temperature; Thermal resistance; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 2005. APEC 2005. Twentieth Annual IEEE
Print_ISBN
0-7803-8975-1
Type
conf
DOI
10.1109/APEC.2005.1453320
Filename
1453320
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