DocumentCode
3417975
Title
Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces
fYear
1997
fDate
9-12 March 1997
Abstract
The following topics were dealt with. Polymer dielectric materials; board materials; encapsulants; BGAs; plastic package materials; direct chip attach; material mechanics; microwave materials; ceramic material; and optoelectronic materials
Keywords
ceramics; dielectric materials; encapsulation; integrated circuit packaging; optoelectronic devices; plastic packaging; printed circuits; surface mount technology; BGAs; board materials; ceramic material; direct chip attach; encapsulants; material mechanics; microwave materials; optoelectronic materials; plastic package materials; polymer dielectric materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Conference_Location
Braselton, GA, USA
Print_ISBN
0-7803-3818-9
Type
conf
DOI
10.1109/ISAPM.1997.581240
Filename
581240
Link To Document