DocumentCode
3418592
Title
Plasma inducted wafer arcing in back-end process and the impact on reliability
Author
Po Li ; Jing-Wei Peng ; Yung-Cheng Wang ; Zhang, David Wei
Author_Institution
Dept. of Microelectron., Fudan Univ., Shanghai, China
fYear
2012
fDate
Oct. 29 2012-Nov. 1 2012
Firstpage
1
Lastpage
3
Abstract
Wafer arcing is a commonly existed phenomenon, leading to wafer yield loss and reliability failure. By removing contact process, we found arcing frequency increase sharply and behave repeatedly; furthermore, we found seal ring of chip would cause wafer edge metal stressed and had reliability problem for the first time. Subsequently, the methods to reduce the arcing frequency and improve reliability were then studied.
Keywords
MOSFET; arcs (electric); electrical contacts; plasma materials processing; semiconductor device reliability; MOSFET; arcing frequency; back-end process; chip; contact process; plasma inducted wafer arcing; reliability failure; seal ring; wafer edge metal stress; wafer yield loss; Metals; Plasmas; Seals; Semiconductor device reliability; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4673-2474-8
Type
conf
DOI
10.1109/ICSICT.2012.6467758
Filename
6467758
Link To Document