AlN HTCC super miniaturized millimeterwave transceiver MCMs, the novel structure for the high reliability, the high performance and the mass productivity

Author

Kaneko, T. ; Watanabe, H. ; Akaishi, M. ; Wada, K.

Author_Institution

Microwave & Satellite Commun. Div., NEC Corp., Yokohama, Japan

Volume

2

fYear

1999

fDate

13-19 June 1999

Firstpage

449

Abstract

NEC has developed a novel structure of millimeterwave multi-chip-modules (MCMs) for the radiocommunications systems based on the aluminum nitride (AlN) high temperature cofired ceramic (HTCC). This package has the LCC and a waveguide I/O structure. We realized both excellent electrical performance and high reliability with more than 10-years of MTTF, for 1.37 inch/spl times/1.37 inch size of the super miniaturized and extremely simplified structure.

Keywords

MIMIC; aluminium compounds; ceramic packaging; integrated circuit reliability; millimetre wave receivers; multichip modules; AlN; MCMs; MTTF; NEC; electrical performance; high temperature cofired ceramic; mass productivity; millimeterwave transceiver; radiocommunications systems; reliability; super miniaturized structure; waveguide I/O structure; Ceramics; Circuits; Dielectric losses; Dielectric substrates; National electric code; Packaging; Propagation losses; Radio communication; Temperature; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1999 IEEE MTT-S International

Conference_Location

Anaheim, CA, USA

Print_ISBN

0-7803-5135-5

Type

conf

DOI

10.1109/MWSYM.1999.779799

Filename

779799