• DocumentCode
    3420959
  • Title

    3-D silicon probe array with hybrid polymer interconnect for chronic cortical recording

  • Author

    Hetke, J.F. ; Williams, J.C. ; Pellinen, D.S. ; Vetter, R.J. ; Kipke, D.R.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
  • fYear
    2003
  • fDate
    20-22 March 2003
  • Firstpage
    181
  • Lastpage
    184
  • Abstract
    The desire to perform chronic recordings from many channels in cortex is high among both neuroscientists and neural prosthesis researchers. The Michigan probe with integrated silicon ribbon cable has been used successfully for obtaining chronic cortical recordings in rodents. As these silicon devices are applied in larger animals and potentially in humans, however, a more mechanically robust, scalable system is required. Here we present a device that takes advantage of several existing, well-characterized technologies and methods and combines them to form a hybrid cortical assembly. The components of the assembly include thin-film multichannel silicon probes and polyimide cables that are electrically and mechanically coupled using thermocompression ball bonding. The resulting probe/cable assembly is low profile (<500 microns) and can be combined with other assemblies to form a 3-D array. Sixteen channel 2-D arrays have been implanted into rat motor cortex and have recorded chronic unit activity.
  • Keywords
    bioelectric potentials; biomedical electrodes; electroencephalography; interconnections; microelectrodes; prosthetics; 2-D arrays; 3-D silicon probe array; Si; chronic cortical recording; discrete spike occurrences; hybrid cortical assembly; hybrid polymer interconnect; implantable probes; microelectrode; neuroprosthesis; polyimide cables; rat motor cortex; thermocompression ball bonding; thin-film multichannel silicon probes; Animals; Assembly; Humans; Polymers; Probes; Prosthetics; Robustness; Rodents; Semiconductor thin films; Silicon devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Neural Engineering, 2003. Conference Proceedings. First International IEEE EMBS Conference on
  • Print_ISBN
    0-7803-7579-3
  • Type

    conf

  • DOI
    10.1109/CNE.2003.1196787
  • Filename
    1196787