• DocumentCode
    3422821
  • Title

    Visco-elastic properties of micron-thick SU-8 polymers measured by two different types of uniaxial tensile tests

  • Author

    Namazu, T. ; Inoue, S. ; Takio, K. ; Fujita, T. ; Maenaka, K. ; Koterazawa, K.

  • Author_Institution
    Dept. of Mech. & Syst. Eng., Hyogo Univ., Himeji, Japan
  • fYear
    2005
  • fDate
    30 Jan.-3 Feb. 2005
  • Firstpage
    447
  • Lastpage
    450
  • Abstract
    This paper describes the effects of specimen size and temperature on viscoelastic properties of microscale SU-8 polymers at intermediate temperatures. Two different types of uniaxial tensile testers examine glassy/rubbery moduli, fracture strain and relaxation modulus of SU-8 polymer specimens. The average glassy modulus at R.T. is 3.5 GPa, which decreases with temperature elevations up to 573 K irrespective of specimen size. Yield stress and fracture strain, however, exhibit the size and temperature dependencies. Besides, we have constructed the master curves of relaxation modulus for micro/milliscale SU-8 polymer specimens. The master curve of microscale SU-8 polymers is in good agreement with that of milliscale polymers, which indicates that the apparent activation energy is independent of the size. The master curves approximated using a Prony series would be widely used to conduct viscoelastic finite element analysis, leading to reliable design of SU-8 micro-components.
  • Keywords
    elastic moduli; micromechanical devices; micromirrors; polymers; tensile testing; viscoelasticity; 573 K; fracture strain; glassy modulus; microscale SU-8 polymers; milliscale SU-8 polymer specimens; relaxation modulus; rubbery modulus; uniaxial tensile testers; uniaxial tensile tests; viscoelastic properties; yield stress; Capacitive sensors; Elasticity; Finite element methods; Polymers; Temperature dependence; Tensile strain; Tensile stress; Testing; Uniaxial strain; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-8732-5
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2005.1453963
  • Filename
    1453963